Encapsulation material of semiconductor device - HS Code 3214101000 - HS Code Lookup

📦Encapsulation material of semiconductor device3214101000

HS Code3214101000

HS ClassificationProducts of the chemical industry and related industries

ChapterCreams and dyestuffs; acetic acid and its derivatives; dyes, pigments and other colouring matter; paints and varnishes; grease and other similar adhesives; inks and inksticks

Import Duty (MFN)9%

普通税率70%

Export Rebate13%

VAT-%

Unit千克 / 无

Supervision—

Description

Sealant plastic cooling,Self-adhesive,Packaging materials,Only special supervision,Advanced electronic resin,BARRIER,Glass paste,Thermal plastic insulating solid crystal LED,The semiconductor device package of material,7634,A semiconductor device package adhesive,Sealant,Surface of the adhesive,Capacitance sealing material epoxy resin curing agent,Sealant A,

Declaration Elements

0:Brand type;1:Export preferences;2:Content;3:Usage;4:Volatile organic matter content under construction;5:Brand (in Chinese or in foreign language);6:Model;7:GTIN;8:CAS;9:Other;